工作职责：

1. Responsible for debugging of packaging process equipment;
2. Responsible for the development of key processes such as bonding, sintering,soldering，pouring and chrent;
3. Responsible for the formulation of packaging process standards;
4. Responsible for the promotion of power module process and advanced process application;
5. Design and optimize packaging process parameters;
6. Formulation and optimization of assembly design rules for power module related products;
7. Responsible for NUD (process development, material evaluation,etc.)

任职资格：

1. Bachelor degree or above, major in Material Engineering, Microelectronics, Electrical engineering, etc.
2. Over 3 years related working experience;
3. Familiar with packaging process and equipment
(dicing/bonding/SMT machines, etc.）